Hong Jin Kim
Senior Member of Technical Staff (SMTS)
Dr. Hong Jin Kim received B.S degree from Korea University in 1999, M.S. from Korea Advanced Institute of Science and Technology (KAIST) in 2001, and Ph.D. in materials science and engineering from The Ohio State University in 2007, respectively. From 2007 to 2013, he had worked at Samsung Electronics Semiconductor R&D center for the advanced memory device development. His major research has focused on materials aspect of tribology, interfacial behavior of materials, semiconductor processing, and chemical mechanical polishing.He published 1 book chapter and 46 papers. He did more than 70 conferences presentations as author/co-authored, and holds 9 patents. His papers are featured at Advances In Engineering, ADINA news, and Tribology and Lubrication Technology. He also has served as editorial board member in several journals (JNNA, AMPC, MME, KSTLE) and technical committee member in international conferences (ADMETA, IFToMM, ICAMM, HKASE).
He has wide and in-depth experiences on FEOL/MOL CMP process development, CMP consumables engineering, fundamentals of CMP, post CMP cleaning, and defect engineering in semiconductor processing.